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                                       Details for article 19 of 32 found articles
 
 
  In-situ X-ray μLaue diffraction study of copper through-silicon vias
 
 
Title: In-situ X-ray μLaue diffraction study of copper through-silicon vias
Author: Sanchez, Dario Ferreira
Reboh, Shay
Weleguela, Monica Larissa Djomeni
Micha, Jean-Sébastien
Robach, Odile
Mourier, Thierry
Gergaud, Patrice
Bleuet, Pierre
Appeared in: Microelectronics reliability
Paging: Volume 56 (2016) nr. C pages 7 p.
Year: 2016
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 19 of 32 found articles
 
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