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Journal description
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Details for article 19 of 32 found articles
| Title: |
In-situ X-ray μLaue diffraction study of copper through-silicon vias |
| Author: |
Sanchez, Dario Ferreira Reboh, Shay Weleguela, Monica Larissa Djomeni Micha, Jean-Sébastien Robach, Odile Mourier, Thierry Gergaud, Patrice Bleuet, Pierre |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 56 (2016) nr. C pages 7 p. |
| Year: |
2016 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 19 of 32 found articles
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