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                                       Details for article 17 of 171 found articles
 
 
  A thermal modeling methodology for power semiconductor modules
 
 
Title: A thermal modeling methodology for power semiconductor modules
Author: van der Broeck, Christoph H.
Conrad, Marcus
De Doncker, Rik W.
Appeared in: Microelectronics reliability
Paging: Volume 55 (2015) nr. 9-10 pages 7 p.
Year: 2015
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 17 of 171 found articles
 
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