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Journal description
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Details for article 5 of 15 found articles
| Title: |
Characterization of copper precipitates on aluminum copper bond pads formed after plasma clean and de-ionized water exposure |
| Author: |
Sethu, Raj Sekar Ng, Hong Seng Chan, Alvin Ong, Cheng Nee Chan, Sieng Fong |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 55 (2015) nr. 7 pages 8 p. |
| Year: |
2015 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 5 of 15 found articles
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