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                                       Details for article 19 of 31 found articles
 
 
  Numerical simulation and fatigue life estimation of BGA packages under random vibration loading
 
 
Title: Numerical simulation and fatigue life estimation of BGA packages under random vibration loading
Author: Liu, Fang
Lu, Ye
Wang, Zhen
Zhang, Zhiming
Appeared in: Microelectronics reliability
Paging: Volume 55 (2015) nr. 12PB pages 9 p.
Year: 2015
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 19 of 31 found articles
 
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