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                                       Details for article 12 of 20 found articles
 
 
  Microstructure and elevated-temperature shear strength of Zn–4Al–3Mg–xSn high-temperature lead-free solders
 
 
Title: Microstructure and elevated-temperature shear strength of Zn–4Al–3Mg–xSn high-temperature lead-free solders
Author: Mahmudi, R.
Farasheh, D.
Appeared in: Microelectronics reliability
Paging: Volume 54 (2014) nr. 8 pages 6 p.
Year: 2014
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 12 of 20 found articles
 
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