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Journal description
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Details for article 11 of 21 found articles
| Title: |
Influence of solder bump arrangements on molded IC encapsulation |
| Author: |
Khor, C.Y. Abdullah, M.Z. Lau, Chun-Sean Leong, W.C. Abdul Aziz, M.S. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 54 (2014) nr. 4 pages 12 p. |
| Year: |
2014 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 11 of 21 found articles
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