|
| next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 1 of 21 found articles
| Title: |
Adhesion improvement of silicon/underfill/polyimide interfaces by UV/ozone treatment and sol–gel derived hybrid layers |
| Author: |
Kim, Sanwi Kim, Taek-Soo |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 54 (2014) nr. 4 pages 7 p. |
| Year: |
2014 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 1 of 21 found articles
| next >> |