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                                       Details for article 18 of 20 found articles
 
 
  Monitoring extent of curing and thermal–mechanical property study of printed circuit board substrates
 
 
Title: Monitoring extent of curing and thermal–mechanical property study of printed circuit board substrates
Author: Zhang, Jie
Li, Tian
Wang, Huiping
Liu, Yi
Yu, Yingfeng
Appeared in: Microelectronics reliability
Paging: Volume 54 (2014) nr. 3 pages 10 p.
Year: 2014
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 18 of 20 found articles
 
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