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Journal description
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Details for article 11 of 20 found articles
| Title: |
Effects of solder balls and arrays on the failure behavior in Package-on-Package structure |
| Author: |
Wang, Xi-Shu Jia, Su Ren, Huai-Hui Pan, Pan |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 54 (2014) nr. 3 pages 8 p. |
| Year: |
2014 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 11 of 20 found articles
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