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Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 10 of 23 found articles
| Title: |
IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging |
| Author: |
Chen, Wen-Hwa Yu, Ching-Feng Cheng, Hsien-Chie Tsai, Yu-min Lu, Su-Tsai |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 53 (2013) nr. 1 pages 11 p. |
| Year: |
2013 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 10 of 23 found articles
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