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Journal description
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Details for article 10 of 27 found articles
| Title: |
Electro- and thermo-migration induced failure mechanisms in Package on Package |
| Author: |
Meinshausen, L. Weide-Zaage, K. Frémont, H. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 52 (2012) nr. 12 pages 18 p. |
| Year: |
2012 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 10 of 27 found articles
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