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Journal description
All volumes of the corresponding journal
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Details for article 3 of 24 found articles
| Title: |
An investigation of reliability of solder joints in microelectronic packages by high temperature moiré method |
| Author: |
Shang, Haixia Gao, Jianxin Ian Nicholson, P. Kenny, Steve |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 51 (2011) nr. 5 pages 9 p. |
| Year: |
2011 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 24 found articles
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