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                                       Details for article 12 of 24 found articles
 
 
  Investigation of the heel crack mechanism in Al connections for power electronics modules
 
 
Title: Investigation of the heel crack mechanism in Al connections for power electronics modules
Author: Celnikier, Y.
Benabou, L.
Dupont, L.
Coquery, G.
Appeared in: Microelectronics reliability
Paging: Volume 51 (2011) nr. 5 pages 10 p.
Year: 2011
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 12 of 24 found articles
 
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