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Journal description
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Details for article 28 of 48 found articles
| Title: |
Interfacial microstructure and bonding strength of Sn–3Ag–0.5Cu and Sn–3Ag–0.5Cu–0.5Ce–xZn solder BGA packages with immersion Ag surface finish |
| Author: |
Lin, Hsiu-Jen Chuang, Tung-Han |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 51 (2011) nr. 2 pages 8 p. |
| Year: |
2011 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 28 of 48 found articles
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