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Journal description
All volumes of the corresponding journal
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Details for article 59 of 59 found articles
| Title: |
Warpage evolution of overmolded ball grid array package during post-mold curing thermal process |
| Author: |
Chiu, Tz-Cheng Huang, Hong-Wei Lai, Yi-Shao |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 51 (2011) nr. 12 pages 11 p. |
| Year: |
2011 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 59 of 59 found articles
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