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Journal description
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Details for article 42 of 59 found articles
| Title: |
Quantitative reliability analysis of flip–chip packages under thermal–cyclic loading and in consideration of parameter uncertainties |
| Author: |
Hsu, Yao Su, Chih-Yen Wu, Wen-Fang |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 51 (2011) nr. 12 pages 6 p. |
| Year: |
2011 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 42 of 59 found articles
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