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Journal description
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Details for article 3 of 28 found articles
| Title: |
A study on the tensile fracture mechanism of 15μm copper wire after EFO process |
| Author: |
Huang, I-Ting Hung, Fei-Yi Lui, Truan-Sheng Chen, Li-Hui Hsueh, Hao-Wen |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 51 (2011) nr. 1 pages 5 p. |
| Year: |
2011 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 28 found articles
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