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Journal description
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Details for article 25 of 28 found articles
| Title: |
Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound |
| Author: |
Tian, Y.H. Hang, C.J. Wang, C.Q. Ouyang, G.Q. Yang, D.S. Zhao, J.P. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 51 (2011) nr. 1 pages 9 p. |
| Year: |
2011 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 25 of 28 found articles
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