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                                       Details for article 88 of 140 found articles
 
 
  Methodology to determine the impact of linewidth variation on chip scale copper/low-k backend dielectric breakdown
 
 
Title: Methodology to determine the impact of linewidth variation on chip scale copper/low-k backend dielectric breakdown
Author: Bashir, Muhammad
Milor, Linda
Kim, Dae Hyun
Lim, Sung Kyu
Appeared in: Microelectronics reliability
Paging: Volume 50 (2010) nr. 9-11 pages 6 p.
Year: 2010
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 88 of 140 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands