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                                       Details for article 4 of 140 found articles
 
 
  Advanced packaging yields higher performance and reliability in power electronics
 
 
Title: Advanced packaging yields higher performance and reliability in power electronics
Author: Bayerer, Reinhold
Appeared in: Microelectronics reliability
Paging: Volume 50 (2010) nr. 9-11 pages 5 p.
Year: 2010
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 4 of 140 found articles
 
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