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Molecular dynamics approach to structure–property correlation in epoxy resins for thermo-mechanical lifetime modeling |
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Title: |
Molecular dynamics approach to structure–property correlation in epoxy resins for thermo-mechanical lifetime modeling |
Author: |
Wunderle, B. Dermitzaki, E. Hölck, O. Bauer, J. Walter, H. Shaik, Q. Rätzke, K. Faupel, F. Michel, B. Reichl, H. |
Appeared in: |
Microelectronics reliability |
Paging: |
Volume 50 (2010) nr. 7 pages 10 p. |
Year: |
2010 |
Contents: |
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Publisher: |
Published by Elsevier B.V. |
Source file: |
Elektronische Wetenschappelijke Tijdschriften |
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