|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 26 of 29 found articles
| Title: |
Study of thinned Si wafer warpage in 3D stacked wafers |
| Author: |
Kim, Youngrae Kang, Sung-Keun Kim, Sarah Eunkyung |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 50 (2010) nr. 12 pages 6 p. |
| Year: |
2010 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 26 of 29 found articles
| << previous | next >> |