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Journal description
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Details for article 1 of 21 found articles
| Title: |
A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages |
| Author: |
Amin, Nowshad Lim, Victor Seng, Foong Chee Razid, Rozaidi Ahmad, Ibrahim |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 49 (2009) nr. 5 pages 7 p. |
| Year: |
2009 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 1 of 21 found articles
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