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Journal description
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Details for article 12 of 18 found articles
| Title: |
Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints |
| Author: |
Chao, Brook Huang-Lin Zhang, Xuefeng Chae, Seung-Hyun Ho, Paul S. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 49 (2009) nr. 3 pages 11 p. |
| Year: |
2009 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 12 of 18 found articles
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