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Journal description
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Details for article 1 of 18 found articles
| Title: |
Alloying modification of Sn–Ag–Cu solders by manganese and titanium |
| Author: |
Lin, Li-Wei Song, Jenn-Ming Lai, Yi-Shao Chiu, Ying-Ta Lee, Ning-Cheng Uan, Jun-Yen |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 49 (2009) nr. 3 pages 7 p. |
| Year: |
2009 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 1 of 18 found articles
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