|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 11 of 22 found articles
| Title: |
Experimental verification of models for underfill flow driven by capillary forces in flip-chip packaging |
| Author: |
Wan, J.W. Zhang, W.J. Bergstrom, D.J. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 48 (2008) nr. 3 pages 6 p. |
| Year: |
2008 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 11 of 22 found articles
| << previous | next >> |