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Journal description
All volumes of the corresponding journal
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Details for article 8 of 20 found articles
| Title: |
Estimation of warpage and thermal stress of IVHs in flip–chip ball grid arrays package by FEM |
| Author: |
Cho, Seunghyun Cho, Soonjin Lee, Joseph Y. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 48 (2008) nr. 2 pages 10 p. |
| Year: |
2008 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 8 of 20 found articles
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