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                                       Details for article 4 of 25 found articles
 
 
  Cohesive zone modeling for structural integrity analysis of IC interconnects
 
 
Title: Cohesive zone modeling for structural integrity analysis of IC interconnects
Author: van Hal, B.A.E.
Peerlings, R.H.J.
Geers, M.G.D.
van der Sluis, O.
Appeared in: Microelectronics reliability
Paging: Volume 47 (2007) nr. 8 pages 11 p.
Year: 2007
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 4 of 25 found articles
 
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