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Journal description
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Details for article 23 of 25 found articles
| Title: |
Studies on solder bump electromigration in Cu/Sn–3Ag–0.5Cu/Cu system |
| Author: |
Yamanaka, Kimihiro Tsukada, Yutaka Suganuma, Katsuaki |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 47 (2007) nr. 8 pages 8 p. |
| Year: |
2007 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 23 of 25 found articles
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