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Journal description
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Details for article 4 of 46 found articles
| Title: |
Analysis of Cu/low-k bond pad delamination by using a novel failure index |
| Author: |
van Gils, M.A.J. van der Sluis, O. Zhang, G.Q. Janssen, J.H.J. Voncken, R.M.J. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 47 (2007) nr. 2-3 pages 8 p. |
| Year: |
2007 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 4 of 46 found articles
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