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Journal description
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Details for article 13 of 46 found articles
| Title: |
Dynamic responses and solder joint reliability under board level drop test |
| Author: |
Luan, Jing-en Tee, Tong Yan Pek, Eric Lim, Chwee Teck Zhong, Zhaowei |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 47 (2007) nr. 2-3 pages 11 p. |
| Year: |
2007 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 13 of 46 found articles
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