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Journal description
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Details for article 6 of 22 found articles
| Title: |
Drop impact reliability testing for lead-free and lead-based soldered IC packages |
| Author: |
Chong, Desmond Y.R. Che, F.X. Pang, John H.L. Ng, Kellin Tan, Jane Y.N. Low, Patrick T.H. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 46 (2006) nr. 7 pages 12 p. |
| Year: |
2006 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 6 of 22 found articles
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