|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 42 of 47 found articles
| Title: |
Thermal performance impacts of heat spreading lids on flip chip packages: With and without heat sinks |
| Author: |
Wakil, Jamil |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 46 (2006) nr. 2-4 pages 6 p. |
| Year: |
2006 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 42 of 47 found articles
| << previous | next >> |