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Journal description
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Details for article 15 of 47 found articles
| Title: |
Evaluation of displacement rate effect in shear test of Sn–3Ag–0.5Cu solder bump for flip chip application |
| Author: |
Kim, Jong-Woong Kim, Dae-Gon Jung, Seung-Boo |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 46 (2006) nr. 2-4 pages 8 p. |
| Year: |
2006 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 15 of 47 found articles
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