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                                       Details for article 15 of 47 found articles
 
 
  Evaluation of displacement rate effect in shear test of Sn–3Ag–0.5Cu solder bump for flip chip application
 
 
Title: Evaluation of displacement rate effect in shear test of Sn–3Ag–0.5Cu solder bump for flip chip application
Author: Kim, Jong-Woong
Kim, Dae-Gon
Jung, Seung-Boo
Appeared in: Microelectronics reliability
Paging: Volume 46 (2006) nr. 2-4 pages 8 p.
Year: 2006
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 15 of 47 found articles
 
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