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                                       Details for article 49 of 104 found articles
 
 
  How to study delamination in plastic encapsulated devices
 
 
Title: How to study delamination in plastic encapsulated devices
Author:
Appeared in: Microelectronics reliability
Paging: Volume 44 (2004) nr. 9-11 pages 6 p.
Year: 2004
Contents:
Publisher: Published by Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 49 of 104 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands