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Journal description
All volumes of the corresponding journal
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Details for article 16 of 16 found articles
| Title: |
Wire-bond failure mechanisms in plastic encapsulated microcircuits and ceramic hybrids at high temperatures |
| Author: |
Oldervoll, Frøydis Strisland, Frode |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 44 (2004) nr. 6 pages 7 p. |
| Year: |
2004 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 16 of 16 found articles
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