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                                       Details for article 9 of 20 found articles
 
 
  Integrating thick copper/Black Diamondâ„¢ layer in CMOS interconnect process for RF passive components
 
 
Title: Integrating thick copper/Black Diamondâ„¢ layer in CMOS interconnect process for RF passive components
Author: Lihui, Guo
Yibin, Zhang
Jeffrey, Su Yong Jie
Appeared in: Microelectronics reliability
Paging: Volume 44 (2004) nr. 4 pages 5 p.
Year: 2004
Contents:
Publisher: Elsevier Science Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 9 of 20 found articles
 
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