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Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 3 of 20 found articles
| Title: |
Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages |
| Author: |
Tee, Tong Yan Zhong, Zhaowei |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 44 (2004) nr. 12 pages 9 p. |
| Year: |
2004 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 20 found articles
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