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Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 6 of 26 found articles
| Title: |
Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages |
| Author: |
Tee, Tong Yan Ng, Hun Shen Yap, Daniel Zhong, Zhaowei |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 43 (2003) nr. 8 pages 10 p. |
| Year: |
2003 |
| Contents: | |
| Publisher: |
Elsevier Science Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 6 of 26 found articles
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