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Journal description
All volumes of the corresponding journal
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Details for article 3 of 24 found articles
| Title: |
Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications |
| Author: |
Tee, Tong Yan Ng, Hun Shen Yap, Daniel Baraton, Xavier Zhong, Zhaowei |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 43 (2003) nr. 7 pages 7 p. |
| Year: |
2003 |
| Contents: | |
| Publisher: |
Elsevier Science Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 24 found articles
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