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Journal description
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Details for article 13 of 20 found articles
| Title: |
Numerical study on the bonding tool position, tip profile and planarity angle influences on TAB/ILB interconnection reliability |
| Author: |
Liu, D.S. Chao, Y.C. Lin, C.H. Shen, G.S. Liu, H.S. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 43 (2003) nr. 6 pages 9 p. |
| Year: |
2003 |
| Contents: | |
| Publisher: |
Elsevier Science Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 13 of 20 found articles
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