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Journal description
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Details for article 3 of 17 found articles
| Title: |
Development of the green plastic encapsulation for high density wirebonded leaded packages |
| Author: |
Lin, T.Y. Fang, C.M. Yao, Y.F. Chua, K.H. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 43 (2003) nr. 5 pages 7 p. |
| Year: |
2003 |
| Contents: | |
| Publisher: |
Elsevier Science Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 17 found articles
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