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Journal description
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Details for article 15 of 17 found articles
| Title: |
Reliability of Au bump––Cu direct interconnections fabricated by means of surface activated bonding method |
| Author: |
Wang, Qian Hosoda, Naoe Itoh, Toshihiro Suga, Tadatomo |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 43 (2003) nr. 5 pages 6 p. |
| Year: |
2003 |
| Contents: | |
| Publisher: |
Elsevier Science Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 15 of 17 found articles
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