|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 3 of 16 found articles
| Title: |
Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni–P by the molten Sn3.5Ag0.5Cu solder alloy |
| Author: |
Islam, M.N Chan, Y.C Sharif, A Alam, M.O |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 43 (2003) nr. 12 pages 7 p. |
| Year: |
2003 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 16 found articles
| << previous | next >> |