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Journal description
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Details for article 13 of 20 found articles
| Title: |
Influences of the moisture absorption on PBGA package’s warpage during IR reflow process |
| Author: |
Chien, Chi-Hui Chen, Yung-Chang Chiou, Yii-Tay Chen, Thaiping Hsieh, Chi-Chang Yan, Jia-Jin Chen, Wei-Zhi Wu, Yii-Der |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 43 (2003) nr. 1 pages 9 p. |
| Year: |
2003 |
| Contents: | |
| Publisher: |
Elsevier Science Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 13 of 20 found articles
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