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                                       Details for article 11 of 20 found articles
 
 
  Impact of probing procedure on flip chip reliability
 
 
Title: Impact of probing procedure on flip chip reliability
Author: Chen, Kuo-Ming
Chiang, Kuo-Ning
Appeared in: Microelectronics reliability
Paging: Volume 43 (2003) nr. 1 pages 8 p.
Year: 2003
Contents:
Publisher: Elsevier Science Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 11 of 20 found articles
 
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