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Journal description
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Details for article 12 of 15 found articles
| Title: |
Study of the effect of reflow time and temperature on Cu–Sn intermetallic compound layer reliability |
| Author: |
Huang, Wei Loman, James M Sener, Bülent |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 42 (2002) nr. 8 pages 6 p. |
| Year: |
2002 |
| Contents: | |
| Publisher: |
Elsevier Science Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 12 of 15 found articles
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