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                                       Details for article 5 of 20 found articles
 
 
  Board level reliability of a stacked CSP subjected to cyclic bending
 
 
Title: Board level reliability of a stacked CSP subjected to cyclic bending
Author: Wu, J.D
Ho, S.H
Huang, C.Y
Liao, C.C
Zheng, P.J
Hung, S.C
Appeared in: Microelectronics reliability
Paging: Volume 42 (2002) nr. 3 pages 10 p.
Year: 2002
Contents:
Publisher: Elsevier Science Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 5 of 20 found articles
 
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