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                                       Details for article 20 of 20 found articles
 
 
  The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method
 
 
Title: The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method
Author: Lin, T.Y.
Leong, W.S.
Chua, K.H.
Oh, R.
Miao, Y.
Pan, J.S.
Chai, J.W.
Appeared in: Microelectronics reliability
Paging: Volume 42 (2002) nr. 3 pages 6 p.
Year: 2002
Contents:
Publisher: Elsevier Science Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 20 of 20 found articles
 
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