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                                       Details for article 6 of 15 found articles
 
 
  Interconnecting to aluminum- and copper-based semiconductors (electroless-nickel/gold for solder bumping and wire bonding)
 
 
Title: Interconnecting to aluminum- and copper-based semiconductors (electroless-nickel/gold for solder bumping and wire bonding)
Author: Strandjord, Andrew J.G
Popelar, Scott
Jauernig, Christine
Appeared in: Microelectronics reliability
Paging: Volume 42 (2002) nr. 2 pages 19 p.
Year: 2002
Contents:
Publisher: Elsevier Science Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 6 of 15 found articles
 
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